| MRC |
Requirement Statement |
Characteristics |
| ALAS |
INTERNAL CONFIGURATION |
JUNCTION CONTACT |
| CTSG |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT |
200.0 DEG CELSIUS JUNCTION |
| CTRD |
POWER RATING PER CHARACTERISTIC |
5.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| CTQN |
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC |
250.0 MAXIMUM COLLECTOR TO BASE VOLTAGE, DC AND 250.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN AND 4.0 MAXIMUM EMITTER TO BASE VOLTAGE, DC |
| FEAT |
SPECIAL FEATURES |
JUNCTION PATTERN ARRANGEMENT: PNP |
| PRMT |
III PRECIOUS MATERIAL |
GOLD |
| TTQY |
TERMINAL TYPE AND QUANTITY |
3 UNINSULATED WIRE LEAD |
| ABJT |
TERMINAL LENGTH |
0.500 INCHES MINIMUM |
| ADAV |
OVERALL DIAMETER |
0.360 INCHES MAXIMUM |
| PMLC |
III PRECIOUS MATERIAL AND LOCATION |
TERMINAL SURFACES GOLD |
| AXGY |
MOUNTING METHOD |
TERMINAL |
| ABHP |
OVERALL LENGTH |
0.250 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
88818-C532000428 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CTMZ |
SEMICONDUCTOR MATERIAL |
SILICON |
| ALAZ |
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION |
TO-39 |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED CASE |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
500.00 MILLIAMPERES MAXIMUM COLLECTOR CURRENT, DC |
| AYQS |
TERMINAL CIRCLE DIAMETER |
0.200 INCHES NOMINAL |
| ABBH |
INCLOSURE MATERIAL |
METAL |
