| MRC |
Requirement Statement |
Characteristics |
| ALAS |
INTERNAL CONFIGURATION |
JUNCTION CONTACT |
| FEAT |
SPECIAL FEATURES |
JUNCTION PATTERN ARRANGEMENT: PNP |
| AKPV |
MOUNTING FACILITY QUANTITY |
2 |
| CTRD |
POWER RATING PER CHARACTERISTIC |
25.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| AXGY |
MOUNTING METHOD |
UNTHREADED HOLE |
| CTQN |
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC |
140.0 NOMINAL BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN AND 100.0 NOMINAL BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN |
| ALAZ |
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION |
TO-3 |
| ABKW |
OVERALL HEIGHT |
0.350 INCHES NOMINAL |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
0.10 AMPERES MAXIMUM BASE CURRENT, INSTANTANEOUS AND 1.00 AMPERES MAXIMUM COLLECTOR CURRENT, INSTANTANEOUS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 PIN AND 1 CASE |
| CTRK |
TRANSFER RATIO |
40.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER |
| CTMZ |
SEMICONDUCTOR MATERIAL |
SILICON |
| ABHP |
OVERALL LENGTH |
1.573 INCHES MAXIMUM |
| ABBH |
INCLOSURE MATERIAL |
METAL |
| ABMK |
OVERALL WIDTH |
1.050 INCHES MAXIMUM |
