| MRC |
Requirement Statement |
Characteristics |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| ADAQ |
BODY LENGTH |
1.060 INCHES MINIMUM AND 1.110 INCHES MAXIMUM |
| CSWJ |
(NON-CORE DATA) WORD QUANTITY |
1024 |
| ADAT |
BODY WIDTH |
0.390 INCHES MINIMUM AND 0.410 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CZZZ |
MEMORY CAPACITY |
UNKNOWN |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND BURN IN AND LOW POWER AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND W/ENABLE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CRHL |
(NON-CORE DATA) BIT QUANTITY |
4096 |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.080 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
19 INPUT |
| CQWX |
OUTPUT LOGIC FORM |
N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.25 WATTS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
22 PRINTED CIRCUIT |
| CZER |
MEMORY DEVICE TYPE |
RAM |
